Services
Plating Processes : Additional Plating Services

CSL offers a wide range of plating services for more specialized applications in addition to the standard processes.

Bead blast is available as either a dry process or a wet hone process.

Bead blast characteristics:

• Generates a matte, dull surface finish
• Improves adhesion of the plated layer by increasing the effective surface area
• In some cases, works as a mechanical cleaning

CSL capabilities in bead blast:

• Dry process:
  • Meets AMS-2431 requirements
  • Garnet, alumina, glass, and mixtures thereof as abrasive materials
  • Various particle sizes to meet the surface texture requirement
  • Fully automated, all-axis unit for consistency and precision
  • Manual unit also available for prototypes
• Wet hone process:
  • Uses water with above materials to impact smoother matte finish
  • Less aggressive than dry process
  • Can be used with all the abrasive materials mentioned above

Applications for bead blast:

• Semiconductor wafer manufacturing equipment
• Change in surface texture
• To create a matte or pewter finish for aesthetic reasons

Plugging:

CSL is able to meet the most exacting customer requirements for products where the interior of small openings must be plugged to avoid the introduction of plating material.

Post bake:

In the post bake process, plated materials are baked to improve stress adhesion.

Strip plating:

When plating needs to be removed for any reason, CSL can strip the plating without affecting the underlying metal.

Ultrasonic finish:

CSL’s ultrasonic finish process combines specially formulated chemicals and a precisely designed ultrasonic tank unit. A proprietary CSL process, ultrasonic finish generates a grain structure to improve the out-gassing and sealing properties of a surface.

Masking:

Masking is required when plating is needed in some sections of an item but not others. CSL can perform masking using liquid or film.

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