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Specialized Processes : Plating on Exotic Materials

A surface is considered passive, even in the case of electrically conducting materials, when the subsequent plating does not provide an adherent layer. This may be due to an ever-present thick oxide layer or the electronegativity of that metal in the electromotive series.

CSL has developed processes to metallize both electrically conducting and non-conducting materials. In the case of conductive but passive materials, CSL employs a high-temperature, hydrogen sintering technique to remove the oxide layer. Metal matrix composites (MMCs) such as copper-tungsten and copper-molybdenum, as well as pure metals and alloys of titanium, tungsten, molybdenum, and nickel, are typical examples of this class. Once a first layer, typically nickel, is sintered (diffused) into the base material, subsequent plating is easily applied to meet the final requirements.

CSL’s plating on non-conductors does not require expensive seed layer metallization. Instead, a unique electroless deposition (either copper or nickel) technique is employed with good adhesion. This process applies to most plastics and ceramics. Wide applications are found in microwave, semiconductor, and connector industries.

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